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Ablestik

 

Recognized worldwide as the top brand for adhesives, films and underfills for semiconductor packaging and microassembly applications, Ablestik products are the preferred choice of leading, global packaging firms.

Our broad range of materials includes conductive and non-conductive adhesives, electrically conductive and insulating films, thermally conductive films, wafer-level underfills and die attach pastes and films. Used in numerous applications within several market segments, Ablestik materials provide cost-effective solutions for today’s most demanding packaging requirements.

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  • Electronics > Electronics Assembly
    For electronics assembly firms seeking the ultimate in product performance and supply chain efficiency, Henkel is the solution. We have researched, analyzed, designed and formulated the most comprehensive range of advanced assembly materials available.

  • Electronics > Semiconductor assembly
    Today’s consumers want smaller devices, more functionality, outstanding reliability and, of course, lower cost. When it comes to semiconductor packaging, it’s possible to have it all with materials solutions from Henkel. As a pioneer in the semiconductor packaging market, Henkel has successfully enabled many of today’s leading consumer products.

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