worldwide as the top brand for adhesives, films and underfills for
semiconductor packaging and microassembly applications, Ablestik
products are the preferred choice of leading, global packaging firms.
Our broad range of materials includes conductive and non-conductive adhesives, electrically conductive and insulating films, thermally conductive films, wafer-level underfills and die attach pastes and films. Used in numerous applications within several market segments, Ablestik materials provide cost-effective solutions for today’s most demanding packaging requirements.